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DmMcuPartNumberModel

**Experimental** MCU part number details parsed into structured properties.

type DmMcuPartNumberModel {
  application: String!
  device: String!
  display: String!
  family: String!
  featureSet: String!
  flashMemorySizeKB: Int!
  groupNumber: String!
  isArrayPackage: Boolean!
  onChipMemoryCode: String!
  package: String!
  packing: String!
  partNumber: String!
  performance: String!
  pinCount: Int!
  pitchMm: Decimal!
  qualityGrade: String!
  romCode: String!
  temperatureRange: DmTemperatureRange
  xMm: Decimal!
  yMm: Decimal!
}

Fields​

DmMcuPartNumberModel.application ● String! non-null scalar​

**Experimental** Application category (e.g., Analog, Display, LowPower).

DmMcuPartNumberModel.device ● String! non-null scalar​

**Experimental** Device type derived from the part number.

DmMcuPartNumberModel.display ● String! non-null scalar​

**Experimental** Formatted display summary of the part details.

DmMcuPartNumberModel.family ● String! non-null scalar​

**Experimental** Device family derived from the part number.

DmMcuPartNumberModel.featureSet ● String! non-null scalar​

**Experimental** Feature set indicator for the device.

DmMcuPartNumberModel.flashMemorySizeKB ● Int! non-null scalar​

**Experimental** On-chip flash memory size in kilobytes. Zero for SiP/Jacketed wireless parts where the position-8 character does not encode a Flash size; see onChipMemoryCode.

DmMcuPartNumberModel.groupNumber ● String! non-null scalar​

**Experimental** Group identifier within the family.

DmMcuPartNumberModel.isArrayPackage ● Boolean! non-null scalar​

**Experimental** True when the package uses a two-dimensional array/grid pin layout with coordinate-named pins (BGA, LGA, WLCSP, and A-QFN) rather than a single perimeter row (standard QFN, LQFP, etc.). Lets the Device Explorer pick the correct package icon for array variants such as A-QFN.

DmMcuPartNumberModel.onChipMemoryCode ● String! non-null scalar​

**Experimental** Raw position-8 character from the part number, retained so SiP/Jacketed wireless parts (where flashMemorySizeKB is 0) still surface the memory-tier code.

DmMcuPartNumberModel.package ● String! non-null scalar​

**Experimental** Package type (e.g., LQFP, BGA, QFN).

DmMcuPartNumberModel.packing ● String! non-null scalar​

**Experimental** Packing type (e.g., Tray, TapeAndReel, FullCarton, Unknown).

DmMcuPartNumberModel.partNumber ● String! non-null scalar​

**Experimental** Full part number string.

DmMcuPartNumberModel.performance ● String! non-null scalar​

**Experimental** Performance tier (e.g., RA0, RA2, RA4, RA6, RA8).

DmMcuPartNumberModel.pinCount ● Int! non-null scalar​

**Experimental** Total number of pins for the package.

DmMcuPartNumberModel.pitchMm ● Decimal! non-null scalar​

**Experimental** Pin pitch in millimeters.

DmMcuPartNumberModel.qualityGrade ● String! non-null scalar​

**Experimental** Quality grade (e.g., Industrial, Consumer).

DmMcuPartNumberModel.romCode ● String! non-null scalar​

**Experimental** ROM code segment (empty when not present in the part number).

DmMcuPartNumberModel.temperatureRange ● DmTemperatureRange object​

**Experimental** Supported operating temperature range.

DmMcuPartNumberModel.xMm ● Decimal! non-null scalar​

**Experimental** Package X dimension in millimeters.

DmMcuPartNumberModel.yMm ● Decimal! non-null scalar​

**Experimental** Package Y dimension in millimeters.